CVE-2019-10574

3Vexday Risk Score

Sin señal de explotación. Ningún artefacto público de explotación conocido hasta ahora.

ssvc Trackepss 1.6%

probabilidad de explotación

1.6%top 27% de las CVE

explotación observada

noninguna fuente lo reporta

Lack of boundary checks for data offsets received from HLOS can lead to out-of-bound read in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8016, APQ8017, APQ8053, APQ8076, APQ8096, APQ8096AU, APQ8098, MDM9150, MDM9205, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MDM9655, MSM8905, MSM8909, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996, MSM8996AU, MSM8998, QCM2150, QCS605, QM215, Rennell, SC7180, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SM6150, SM7150, SM8150, SXR1130, SXR2130

Productos afectados

Qualcomm, Inc. · Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking

Referencias

https://research.checkpoint.com/2019/the-road-to-qualcomm-trustzone-apps-fuzzing/https://www.qualcomm.com/company/product-security/bulletins/april-2020-bulletin