CVE-2019-14074

CVE-2019-14074: fallo en Qualcomm, Inc. Snapdragon Auto, Snapdragon…

Publicada el · Actualizada el

3Vexday Risk Score

Sin señal de explotación. Ningún artefacto público de explotación conocido hasta ahora.

ssvc Trackepss 0.2%
u'Heap overflow in diag command handler due to lack of check of packet length received from user' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8017, APQ8053, APQ8076, APQ8096AU, APQ8098, Bitra, IPQ6018, IPQ8074, Kamorta, MDM9150, MDM9205, MDM9206, MDM9207C, MDM9607, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8905, MSM8909, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996, MSM8996AU, MSM8998, Nicobar, QCA8081, QCM2150, QCN7605, QCS404, QCS405, QCS605, QCS610, QM215, Rennell, SA415M, SA6155P, Saipan, SC7180, SC8180X, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130