CVE-2019-10484
3Vexday Risk Score
Sem sinal de exploração. Nenhum artefato público de exploração conhecido até agora.
ssvc Trackepss 0.2%
probabilidade de exploração
0.2%top 94% das CVEs
exploração observada
nãonenhuma fonte reporta
Use after free issue occurs when command destructors access dynamically allocated response buffer which is already deallocated during previous command teardwon sequence in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8098, MSM8909W, Nicobar, QCS405, QCS605, SDA845, SDM660, SDM670, SDM710, SDM845, SDX24, SM6150, SM7150, SM8150, SM8250, SXR2130