CVE-2019-2288
3Vexday Risk Score
Sem sinal de exploração. Nenhum artefato público de exploração conhecido até agora.
ssvc Trackepss 0.2%
probabilidade de exploração
0.2%top 91% das CVEs
exploração observada
nãonenhuma fonte reporta
Out of bound write in TZ while copying the secure dump structure on HLOS provided buffer as a part of memory dump in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8017, APQ8053, APQ8096, APQ8096AU, APQ8098, IPQ8074, MDM9150, MDM9206, MDM9607, MDM9650, MSM8905, MSM8909, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8976, MSM8996, MSM8996AU, MSM8998, QCA8081, QCS605, QM215, SDA660, SDA845, SDM429, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, Snapdragon_High_Med_2016, SXR1130