CVE-2019-2306

CVE-2019-2306: falha em Qualcomm, Inc. Snapdragon Auto, Snapdragon…

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3Vexday Risk Score

Sem sinal de exploração. Nenhum artefato público de exploração conhecido até agora.

ssvc Trackepss 0.2%
Improper casting of structure while handling the buffer leads to out of bound read in display in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in MDM9150, MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, QCS405, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 665, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDA660, SDM439, SDM630, SDM660, SDX20
Produtos afetados
Qualcomm, Inc. · Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
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