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CVE-2021-30350

CVE-2021-30350

CVSS 8.4 HIGHEPSS 0.2%
Lack of MBN header size verification against input buffer can lead to memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables
CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H
Produtos afetados
Qualcomm, Inc. · Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables

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Referências
https://www.qualcomm.com/company/product-security/bulletins/april-2022-bulletin