CVE-2022-25334: falha de alta gravidade em Texas Instruments OMAP
Stack overflow on SK_LOAD signature length field in Texas Instruments OMAP L138
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21Vexday Risk Score
Sem sinal de exploração. Nenhum artefato público de exploração conhecido até agora.
ssvc Trackcvss 8.2epss 0.2%
The Texas Instruments OMAP L138 (secure variants) trusted execution environment (TEE) lacks a bounds check on the signature size field in the SK_LOAD module loading routine, present in mask ROM. A module with a sufficiently large signature field causes a stack overflow, affecting secure kernel data pages. This can be leveraged to obtain arbitrary code execution in secure supervisor context by overwriting a SHA256 function pointer in the secure kernel data area when loading a forged, unsigned SK_LOAD module encrypted with the CEK (obtainable through CVE-2022-25332). This constitutes a full break of the TEE security architecture.
CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:C/C:H/I:H/A:H/E:F/RL:U/RC:C/CR:H/IR:H/AR:H/MAV:L/MAC:L/MPR:H/MUI:N/MS:C/MC:H/MI:H/MA:H
Produtos afetados
Texas Instruments · OMAPCVEs relacionadas — Texas Instruments OMAP
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Referências
https://tetraburst.com/