CVE-2017-18135

CVE-2017-18135: vulnerability in Qualcomm, Inc. Snapdragon Mobile

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3Vexday Risk Score

No sign of exploitation. No public exploitation artifact known so far.

ssvc Trackepss 1.3%
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile MDM9650, MDM9655, SD 450, SD 625, SD 650/52, SD 835, SD 845, SD 850, in the Wireless Data Service (WDS) module, a buffer overflow can occur.
Affected products
Qualcomm, Inc. · Snapdragon Mobile
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