CVE-2017-18173
CVE-2017-18173
In case of using an invalid android verified boot signature with very large length, an integer underflow occurs in Snapdragon Mobile in SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 810, SD 820, SD 835, SDM630, SDM636, SDM660, Snapdragon_High_Med_2016.
Affected products
Qualcomm Technologies, Inc. · Snapdragon MobileWant to know if your infrastructure is exposed to this?
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