CVE-2017-18173
CVE-2017-18173
In case of using an invalid android verified boot signature with very large length, an integer underflow occurs in Snapdragon Mobile in SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 810, SD 820, SD 835, SDM630, SDM636, SDM660, Snapdragon_High_Med_2016.
Productos afectados
Qualcomm Technologies, Inc. · Snapdragon Mobile¿Quieres saber si tu infraestructura está expuesta a esto?
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