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CVE-2017-18297

CVE-2017-18297

EPSS 0.3%
Double memory free while closing TEE SE API Session management in Snapdragon Mobile in version SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820.
Affected products
Qualcomm, Inc. · Snapdragon Mobile

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References
https://source.android.com/security/bulletin/2018-08-01#qualcomm-closed-source-componentshttps://www.qualcomm.com/company/product-security/bulletinshttp://www.securitytracker.com/id/1041432