CVE-2017-18305

CVE-2017-18305: vulnerability in Qualcomm, Inc. Snapdragon Mobile, Snapdragon…

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3Vexday Risk Score

No sign of exploitation. No public exploitation artifact known so far.

ssvc Trackepss 0.2%
XBL sec mem dump system call allows complete control of EL3 by unlocking all XPUs if enable fuse is not blown in Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 835.
Affected products
Qualcomm, Inc. · Snapdragon Mobile, Snapdragon Wear
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