CVE-2017-18309

CVE-2017-18309: vulnerability in Qualcomm, Inc. Snapdragon Mobile

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3Vexday Risk Score

No sign of exploitation. No public exploitation artifact known so far.

ssvc Trackepss 0.2%
A micro-core of QMP transportation may cause a macro-core to read from or write to arbitrary memory in Snapdragon Mobile in version SD 845, SD 850.
Affected products
Qualcomm, Inc. · Snapdragon Mobile
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