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CVE-2017-18323

CVE-2017-18323

EPSS 0.2%
Cryptographic key material leaked in TDSCDMA RRC debug messages in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SDA660, SDX20, SXR1130.
Affected products
Qualcomm, Inc. · Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear

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References
https://www.qualcomm.com/company/product-security/bulletinshttp://www.securityfocus.com/bid/106128