CVE-2018-11857

CVE-2018-11857: vulnerability in Qualcomm, Inc. Snapdragon Mobile

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3Vexday Risk Score

No sign of exploitation. No public exploitation artifact known so far.

ssvc Trackepss 0.2%
Improper input validation in WLAN encrypt/decrypt module can lead to a buffer copy in Snapdragon Mobile in version SD 835, SD 845, SD 850
Affected products
Qualcomm, Inc. · Snapdragon Mobile
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