CVE-2018-11867

CVE-2018-11867: vulnerability in Qualcomm, Inc. Snapdragon Mobile

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3Vexday Risk Score

No sign of exploitation. No public exploitation artifact known so far.

ssvc Trackepss 0.3%
Lack of buffer length check before copying in WLAN function while processing FIPS event, can lead to a buffer overflow in Snapdragon Mobile in version SD 845.
Affected products
Qualcomm, Inc. · Snapdragon Mobile
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