CVE-2018-11876

CVE-2018-11876: vulnerability in Qualcomm, Inc. Snapdragon Mobile

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3Vexday Risk Score

No sign of exploitation. No public exploitation artifact known so far.

ssvc Trackepss 0.2%
Lack of input validation while copying to buffer in WLAN will lead to a buffer overflow in Snapdragon Mobile in version SD 835, SD 845, SD 850, SDA660.
Affected products
Qualcomm, Inc. · Snapdragon Mobile
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