CVE-2019-14004

CVE-2019-14004: vulnerability in Qualcomm, Inc. Snapdragon Auto, Snapdragon…

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3Vexday Risk Score

No sign of exploitation. No public exploitation artifact known so far.

ssvc Trackepss 0.9%
Buffer overflow occurs while processing invalid MKV clip, which has invalid EBML size in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8017, APQ8053, APQ8064, APQ8096AU, APQ8098, MDM9206, MDM9207C, MDM9607, MSM8905, MSM8909, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8939, MSM8940, MSM8953, MSM8996, MSM8996AU, MSM8998, Nicobar, QCS605, QM215, Rennell, SA6155P, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDX20, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130
Affected products
Qualcomm, Inc. · Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
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