CVE-2019-14097

CVE-2019-14097: vulnerability in Qualcomm, Inc. Snapdragon Auto, Snapdragon…

Published · Updated

3Vexday Risk Score

No sign of exploitation. No public exploitation artifact known so far.

ssvc Trackepss 0.9%
Possible buffer overflow in WLAN Parser due to lack of length check when copying data in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in APQ8096, APQ8096AU, APQ8098, IPQ6018, IPQ8074, MDM9607, MDM9640, MDM9650, MSM8996AU, MSM8998, Nicobar, QCA6174A, QCA6574, QCA6574AU, QCA6584, QCA6584AU, QCA8081, QCA9377, QCA9379, QCN7605, QCS405, QCS605, Rennell, SA6155P, SC8180X, SDA660, SDA845, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130