CVE-2019-2302

CVE-2019-2302: vulnerability in Qualcomm, Inc. Snapdragon Auto, Snapdragon…

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3Vexday Risk Score

No sign of exploitation. No public exploitation artifact known so far.

ssvc Trackepss 0.7%
While processing vendor command which contains corrupted channel count, an integer overflow occurs and finally will lead to heap overflow. in Snapdragon Auto, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8017, APQ8053, APQ8096AU, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MSM8905, MSM8909, MSM8909W, MSM8976, MSM8996AU, QCA6174A, QCA6574AU, QCA9377, QCA9379, QCN7605, QCS405, QCS605, SDA845, SDM636, SDM660, SDM670, SDM710, SDM845, SDX20, SDX24, SM6150, SM8150
Affected products
Qualcomm, Inc. · Snapdragon Auto, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
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