CVE-2019-2311: vulnerability in Qualcomm, Inc. Snapdragon Auto, Snapdragon…
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Follow this CVE+ Monitor Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking
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3Vexday Risk Score
No sign of exploitation. No public exploitation artifact known so far.
ssvc Trackepss 0.9%
Possible buffer overflow in WLAN handler due to lack of validation of destination buffer size before copying it in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8017, APQ8053, APQ8096, APQ8096AU, APQ8098, IPQ8074, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MSM8996, MSM8996AU, MSM8998, QCA6174A, QCA6574, QCA6574AU, QCA6584, QCA6584AU, QCA8081, QCA9377, QCA9379, QCA9886, QCS605, SA6155P, SDA660, SDA845, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SM6150, SM7150, SM8150, SXR1130
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