CVE-2020-11202

3Vexday Risk Score

Sin señal de explotación. Ningún artefacto público de explotación conocido hasta ahora.

ssvc Trackepss 1.5%

probabilidad de explotación

1.5%top 26% de las CVE

explotación observada

noninguna fuente lo reporta

Buffer overflow/underflow occurs when typecasting the buffer passed by CPU internally in the library which is not aligned with the actual size of the structure' in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile in QCM6125, QCS410, QCS603, QCS605, QCS610, QCS6125, SA6145P, SA6155, SA6155P, SA8155, SA8155P, SDA640, SDA670, SDA845, SDM640, SDM670, SDM710, SDM830, SDM845, SDX50M, SDX55, SDX55M, SM6125, SM6150, SM6150P, SM6250, SM6250P, SM7125, SM7150, SM7150P, SM8150, SM8150P

Productos afectados

Qualcomm, Inc. · Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile

Referencias

https://blog.checkpoint.com/2020/08/06/achilles-small-chip-big-peril/https://research.checkpoint.com/2021/pwn2own-qualcomm-dsp/https://www.qualcomm.com/company/product-security/bulletins/november-2020-bulletin