CVE-2020-11202

3Vexday Risk Score

Sem sinal de exploração. Nenhum artefato público de exploração conhecido até agora.

ssvc Trackepss 1.5%

probabilidade de exploração

1.5%top 26% das CVEs

exploração observada

nãonenhuma fonte reporta

Buffer overflow/underflow occurs when typecasting the buffer passed by CPU internally in the library which is not aligned with the actual size of the structure' in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile in QCM6125, QCS410, QCS603, QCS605, QCS610, QCS6125, SA6145P, SA6155, SA6155P, SA8155, SA8155P, SDA640, SDA670, SDA845, SDM640, SDM670, SDM710, SDM830, SDM845, SDX50M, SDX55, SDX55M, SM6125, SM6150, SM6150P, SM6250, SM6250P, SM7125, SM7150, SM7150P, SM8150, SM8150P

Produtos afetados

Qualcomm, Inc. · Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile

Referências

https://blog.checkpoint.com/2020/08/06/achilles-small-chip-big-peril/https://research.checkpoint.com/2021/pwn2own-qualcomm-dsp/https://www.qualcomm.com/company/product-security/bulletins/november-2020-bulletin