CVE-2019-10611

CVE-2019-10611: falha em Qualcomm, Inc. Snapdragon Auto, Snapdragon…

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3Vexday Risk Score

Sem sinal de exploração. Nenhum artefato público de exploração conhecido até agora.

ssvc Trackepss 0.9%
Buffer overflow can occur while processing clip due to lack of check of object size before parsing in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8017, APQ8053, APQ8064, APQ8096AU, APQ8098, MDM9206, MDM9207C, MDM9607, MSM8905, MSM8909, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8939, MSM8940, MSM8953, MSM8996, Nicobar, QCS605, QM215, SA6155P, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM632, SDM660, SDM670, SDM710, SDM845, SDX20, SM6150, SM8150, SM8250, SXR1130, SXR2130
Produtos afetados
Qualcomm, Inc. · Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
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