CVE-2019-10611

CVE-2019-10611: vulnerability in Qualcomm, Inc. Snapdragon Auto, Snapdragon…

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3Vexday Risk Score

No sign of exploitation. No public exploitation artifact known so far.

ssvc Trackepss 0.9%
Buffer overflow can occur while processing clip due to lack of check of object size before parsing in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8017, APQ8053, APQ8064, APQ8096AU, APQ8098, MDM9206, MDM9207C, MDM9607, MSM8905, MSM8909, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8939, MSM8940, MSM8953, MSM8996, Nicobar, QCS605, QM215, SA6155P, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM632, SDM660, SDM670, SDM710, SDM845, SDX20, SM6150, SM8150, SM8250, SXR1130, SXR2130
Affected products
Qualcomm, Inc. · Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
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