CVE-2019-14050

CVE-2019-14050: falha em Qualcomm, Inc. Snapdragon Auto, Snapdragon…

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3Vexday Risk Score

Sem sinal de exploração. Nenhum artefato público de exploração conhecido até agora.

ssvc Trackepss 0.2%
Out-of-bound writes occurs due to lack of check of buffer size will cause buffer overflow only in 32bit architecture. in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in APQ8009, MDM9150, MDM9205, MDM9607, MDM9650, MSM8905, Nicobar, QCS405, QCS605, Rennell, SA6155P, SDA660, SDA845, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX24, SM6150, SM7150, SM8150, SXR1130
Produtos afetados
Qualcomm, Inc. · Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking
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