CVE-2017-18313

CVE-2017-18313: vulnerability in Qualcomm, Inc. Snapdragon Mobile, Snapdragon…

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3Vexday Risk Score

No sign of exploitation. No public exploitation artifact known so far.

ssvc Trackepss 0.3%
Under certain mode of operations, HLOS may be able get direct or indirect access through DXE channels to tamper with the authenticated WCNSS firmware stored in DDR because DXE-accessible memory is located within the authenticated image in Snapdragon Mobile and Snapdragon Wear in version MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 615/16/SD 415, SD 617.
Affected products
Qualcomm, Inc. · Snapdragon Mobile, Snapdragon Wear
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