CVE-2019-10557

CVE-2019-10557: vulnerability in Qualcomm, Inc. Snapdragon Auto, Snapdragon…

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3Vexday Risk Score

No sign of exploitation. No public exploitation artifact known so far.

ssvc Trackepss 1.1%
Out-of-bound read in the wireless driver in the Linux kernel due to lack of check of buffer length. in Snapdragon Auto, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music in APQ8009, APQ8017, APQ8053, APQ8096AU, MDM9206, MDM9207C, MDM9607, MDM9650, MSM8996AU, QCA6174A, QCA6574AU, QCA9377, QCA9379, QCN7605, QCS605, SDA660, SDA845, SDM630, SDM636, SDM660, SDX20, SDX55, SXR1130
Affected products
Qualcomm, Inc. · Snapdragon Auto, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music
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