CVE-2019-10622

CVE-2019-10622: vulnerability in Qualcomm, Inc. Snapdragon Auto, Snapdragon…

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3Vexday Risk Score

No sign of exploitation. No public exploitation artifact known so far.

ssvc Trackepss 0.5%
Out of bound memory access can happen while parsing ADSP message due to lack of check of size of payload received from userspace in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8096AU, IPQ4019, IPQ6018, IPQ8064, IPQ8074, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, QCN7605, QCS605, SC8180X, SDM710, SDX24, SDX55, SM8150, SM8250, SXR2130
Affected products
Qualcomm, Inc. · Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking
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