CVE-2019-14112

CVE-2019-14112: vulnerability in Qualcomm, Inc. Snapdragon Auto, Snapdragon…

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3Vexday Risk Score

No sign of exploitation. No public exploitation artifact known so far.

ssvc Trackepss 0.9%
Potential buffer overflow while processing CBF frames due to lack of check of buffer length before copy in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking in APQ8098, IPQ6018, IPQ8074, MSM8998, Nicobar, QCA8081, QCN7605, QCS404, QCS605, Rennell, SC7180, SC8180X, SDA660, SDA845, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SM6150, SM7150, SM8150, SXR1130, SXR2130
Affected products
Qualcomm, Inc. · Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking
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In the same product, most dangerous first.

CVE-2019-10622—CVE-2019-10622EPSS 0.5%