CVE-2019-14110: vulnerability in Qualcomm, Inc. Snapdragon Auto, Snapdragon…
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Follow this CVE+ Monitor Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking
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3Vexday Risk Score
No sign of exploitation. No public exploitation artifact known so far.
ssvc Trackepss 0.9%
Buffer overflow can occur in function wlan firmware while copying association frame content if frame length is more than the maximum buffer size in case of SAP mode in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8017, APQ8053, APQ8064, APQ8096, APQ8096AU, APQ8098, IPQ6018, IPQ8074, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MSM8996, MSM8996AU, MSM8998, Nicobar, QCA4531, QCA6174A, QCA6564, QCA6574AU, QCA6584, QCA6584AU, QCA8081, QCA9377, QCA9379, QCA9886, QCN7605, QCS404, QCS405, QCS605, Rennell, SA6155P, SC7180, SC8180X, SDA660, SDA845, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SM6150, SM7150, SM8150, SXR1130, SXR2130
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In the same product, most dangerous first.