CVE-2019-14113: vulnerability in Qualcomm, Inc. Snapdragon Auto, Snapdragon…
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Follow this CVE+ Monitor Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking
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3Vexday Risk Score
No sign of exploitation. No public exploitation artifact known so far.
ssvc Trackepss 0.9%
Buffer overflow can occur in In WLAN firmware while unwraping data using CCMP cipher suite during parsing of EAPOL handshake frame in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8017, APQ8053, APQ8064, APQ8096, APQ8096AU, APQ8098, IPQ6018, IPQ8074, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MSM8996AU, MSM8998, Nicobar, QCA4531, QCA6174A, QCA6564, QCA6574, QCA6574AU, QCA6584, QCA6584AU, QCA8081, QCA9377, QCA9379, QCA9886, QCN7605, QCS404, QCS405, QCS605, Rennell, SA6155P, SC7180, SC8180X, SDA660, SDA845, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SM6150, SM7150, SM8150, SXR1130, SXR2130
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In the same product, most dangerous first.