CVE-2017-18172

CVE-2017-18172: vulnerability in Qualcomm, Inc. Snapdragon Automobile…

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Follow this CVE+ Monitor Snapdragon Automobile, Snapdragon Mobile

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3Vexday Risk Score

No sign of exploitation. No public exploitation artifact known so far.

ssvc Trackepss 0.2%
In a device, with screen size 1440x2560, the check of contiguous buffer will overflow on certain buffer size resulting in an Integer Overflow or Wraparound in System UI in Snapdragon Automobile, Snapdragon Mobile in version MDM9635M, SD 400, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 820A, SD 835, SDM630, SDM636, SDM660, Snapdragon_High_Med_2016.
Affected products
Qualcomm, Inc. · Snapdragon Automobile, Snapdragon Mobile
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