CVE-2018-11264

CVE-2018-11264: vulnerability in Qualcomm, Inc. Snapdragon Automobile…

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3Vexday Risk Score

No sign of exploitation. No public exploitation artifact known so far.

ssvc Trackepss 0.2%
Possible buffer overflow in Ontario fingerprint code due to lack of input validation for the parameters coming into TZ from HLOS in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in versions MDM9206, MDM9607, MDM9650, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SDA660.
Affected products
Qualcomm, Inc. · Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear
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