CVE-2019-10537

CVE-2019-10537: vulnerability in Qualcomm, Inc. Snapdragon Auto, Snapdragon…

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3Vexday Risk Score

No sign of exploitation. No public exploitation artifact known so far.

ssvc Trackepss 0.2%
Improper validation of event buffer extracted from FW response can lead to integer overflow, which will allow to pass the length check and eventually will lead to buffer overwrite when event data is copied to context buffer in Snapdragon Auto, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music in MDM9607, Nicobar, QCA6574AU, QCN7605, QCS405, QCS605, SDM660, SDM845, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130
Affected products
Qualcomm, Inc. · Snapdragon Auto, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music
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In the same product, most dangerous first.

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